SCHEME OF EXAMINATION
B.TECH DEGREE COURSE (Common
to all branches)
FIRST SEMESTER EXAMINATION
Code
No. Paper L T P S Credits
ETMA 101 Applied
Mathematics-I 3 1 0 0 4
ETPH 103 Applied
Physics-I 2 1 0 0 3
ETCH 105 Applied
Chemistry-I 2 1 0 0 3
ETME 107 Manufacturing
Process 2 0 0 0 2
ETCS 109 Introduction
to Computers 2 1 0 0 3
ETEL 111 Communication
Skills-I 2 1 0 0 3
ETEL 113 Impact
of Science &
Technology on Society 2 0 0 0 2
ETPH 151 Applied
Physics Lab.-I - - 2 0 1
ETCH 153 Applied
Chemistry Lab.-I - - 2 0 1
ETCS 155 Introduction
to Computers Lab. - - 3 0 1
½
ETME 157 Workshop
Practice-I - - 3 0 1
½
ETME 159 Engg.
Graphics Lab. - - 2 0 1
TOTAL: 15 5 12 0 26
SCHEME OF EXAMINATION
B.TECH DEGREE COURSE (Common
to all branches)
SECOND SEMESTER EXAMINATION
Code
No. Paper L T P S Credits
ETMA 102 Applied
Mathematics-II 3 1 0 0 4.
ETPH 104 Applied
Physics-II 2 1 0 0 3
ETCH 106 Applied
Chemistry-II 2 ½ 0 0 2
½
ETCS 108 Programming
& Auto CAD 2 0 0 0 2
ETME 110 Engineering
Mechanics 3 1 0 0 4
ETEC 112 Electrical
Science 3 1 0 0 4
ETEL 114 Communication
Skills-II 1 ½ 0 0 1
½
ETPH 152 Applied
Physics Lab.-II - 0 2 0 1
ETCH 154 Applied
Chemistry Lab.-II - 0 2 0 1
ETCS 156 Programming
& Auto CAD Lab - 0 3 0 2
ETME 158 Engineering
Mechanics Lab. - 0 2 0 1
ETEC 160 Electrical
Science Lab. - 0 2 0 1
TOTAL : 16 5 11 0 27
SCHEME OF EXAMINATION
B.TECH. (ELECTRONICS AND
COMMUNICATION ENGINEERING)
THIRD SEMESTER EXAMINATION
Code
No. Paper L T P S Credits
ETMA 201 Applied
Mathematics-III 3 1 0 0 4
ETEC 203 Analog
Electronics I 3 1 0 0 4
ETEC 205 Circuits
& Systems 3 1 0 0 4
ETCS 207 Foundations
of Computer
Science 3 1 0 0 4
ETCS 209 Object
Oriented Progg. 3 1 0 0 4
ETCS 211 Data
Structures 3 1 0 0 4
ETEC 251 Analog
Electronics I Lab. 0 0 2 0 1
ETEC 253 Circuits
& Systems Lab. 0 0 2 0 1
ETCS 255 Object
Oriented Progg. Lab. 0 0 2 0 1
ETCS 257 Data
Structures Lab. 0 0 2 0 1
TOTAL : 18 6 8 0 28
SCHEME OF EXAMINATION
B.TECH. (ELECTRONICS AND
COMMUNICATION ENGINEERING)
FOURTH SEMESTER EXAMINATION
Code
No. Paper L T P S Credits
ETEC 202 Electro-magnetic
fields &
Transmission lines 3 1 0 0 4
ETEC 204 Analog
Electronics-II 3 1 0 0 4
ETEC 206 Digital
Circuits & Systems-I 3 1 0 0 4
ETEC 208 Communication
Systems & 3 1 0 0 4
Circuits
ETCS 210 Computer
Graphics & 3 1 0 0 4
Multimedia
ETCS 212 Operating
Systems & System 3 1 0 0 4
Programming -I
ETEC 252 Analog
Electronics-II Lab. 0 0 2 0 1
ETEC 254 Digital
Circuits & System-I Lab 0 0 2 0 1
ETEC 256 Communication
Systems & Circuits
Lab. 0 0 2 0 1
ETCS 258 Computer
Graphics & Multimedia
Lab. 0 0 2 0 1
ETCS 260 Operating
Systems & System
Programming- I Lab. 0 0 2 0 1
TOTAL: 18 6 8 0 29
Note: An in-house Training Programme of 6 weeks is
to be conducted during the Summer-break after the IV Semester. This carries two credits, which will be
accounted for in the V Semester (ETEC 363)
SCHEME OF EXAMINATION
B.TECH. (ELECTRONICS AND
COMMUNICATION ENGINEERING)
FIFTH SEMESTER EXAMINATION
Code
No. Paper L T P S Credits
ETEC 301 Digital Circuits and Systems-II 3 1 0 0 4
ETEC 303 Microprocessor System-I 3 1 0 0 4
ETCS 305 Computer
Architecture 3 1 0 0 4
ETEC 307 Telecommunication
Networks 3 1 0 0 4
ETCS 309 Data
Base Management System 3 1 0 0 4
ETEC 351 Digital Circuits & Systems-II Lab. 0 0 2 0 1
ETEC 353 Microprocessor
System-I 0 0 2 0 1
ETCS 355 Computer
Architecture Lab. 0 0 2 0 1
ETEC 357 Telecommunication
Networks
Lab 0 0 2 0 1
ETCS 359 Data
Base Management
System Lab. 0 0 2 0 1
ETCS 361 Programming
I Lab. (or CAD) 0 0 2 0 1
ETEC 363 Practical
training undergone
At the end of Fourth
Semester 0 0 0 0 2
TOTAL : 15 5 12 0 28
SCHEME OF EXAMINATION
B.TECH. (ELECTRONICS AND
COMMUNICATION ENGINEERING)
SIXTH SEMESTER EXAMINATION
Code
No. Paper L T P S Credits
ETEC 302 Microprocessor
System-II 3 1 0 0 4
ETEC 304 Microwave
Engineering 3 1 0 0 4
ETEC 306 Digital
Signal Processing 3 1 0 0 4
ETEC 308 Data
Communication Networks 3 1 0 0 4
ETEC 310 VLSI
Design 3 1 0 0 4
ETEC 352 Microprocessor
System-II Lab 0 0 2 0 1
ETEC 354 Microwave
Engg. Lab. 0 0 2 0 1
ETEC 356 Digital
Signal Processing 0 0 2 0 1
ETEC 358 Data
Communication
Networks Lab. 0 0 2 0 1
ETEC 360 VLSI
Design Lab. 0 0 2 0 1
TOTAL: 15 5 10 0 25
Note : Training Programme of 6 weeks is to be
conducted during Summer-break after VI Semester. This carries three credits which will be accounted for in the VII
Semester ETEC 461
SCHEME OF EXAMINATION
B.TECH. (ELECTRONICS AND
COMMUNICATION ENGINEERING)
SEVENTH SEMESTER EXAMINATION
Code
No. Paper L T P S Credits
ETEC 401 Control
Systems 3 1 0 0 4
ETCS 403 Software
Engineering 3 1 0 0 4
ETEC 405 Network
Technology 3 1 0 0 4
ELECTIVES
(Select any two)
ETEC 407 Advanced
VLSI Design 3 1 0 0 4
Architecture
ETEC 417 Optical Communication 3 1 0 0 4
ETIT 419 Artificial Intelligence 3 1 0 0 4
ETEC 451 Control
Systems Lab. 0 0 2 0 1
ETCS 453 Software
Engineering Lab. 0 0 2 0 1
ETEC 455 Network
Technology Lab 0 0 2 0 1
ETEC 457 Practical
based on ELECTIVES 0 0 2 0 1
ETCS 459 Programming
II Lab. 0 0 2 0 1
(Mat Lab)
ETEC 461 Practical
Training undergone
at the end of Sixth
Semester 0 0 0 0 3
TOTAL : 15 5 10 0 28
SCHEME OF EXAMINATION
B.TECH. (ELECTRONICS AND
COMMUNICATION ENGINEERING)
EIGHTH SEMESTER EXAMINATION
Code
No. Paper L T P S Credits
ETEC 402 Consumer
Electronics 3 1 0 0 4
ETEC 404 Satellite
& Mobile Comm. 3 1 0 0 4
ELECTIVES
(Select any two)
ETEC 406 Instrumentation
3 1 0 0 4
ETEC 408 Integrated
Circuit Technology 3 1 0 0 4
ETIT 410 Digital
Image Processing 3 1 0 0 4
ETIT
412 Microwave
Devices 3 1 0 0 4
ETIT 414 Network
Management 3 1 0 0 4
and Security
ETEC 416 Embedded
Systems 3 1 0 0 4
ETEC 452 Consumer
Electronics Lab. 0 0 2 0 1
ETEC 454 Satellite
& Mobile Comm. Lab. 0 0 2 0 1
ETEC 456 Practical
based on ELECTIVES 0 0 2 0 1
ETEC 458 Project 0 0 8 0 8
TOTAL: 12 4 14 0 27
ETMA 101 Applied Mathematics -I L T C
3 1 4
I. Successive Differentiation, Leibnitzs theorem (without proof). Mean value theorem, Taylors theorem, Remainder theorem, Asymptotes, Curvature.
II. Infinite Series: Convergence, divergence, Comparison test, Ratio test, Cauchy Leibnitzs theorem (without proof), Absolute and Conditional Convergence. Taylor and Maclaurin series, Power Series, Radius of Convergence.
III. Integral Calculus: Fundamental theorems, Reduction Formulae, Properties of definite Integral, Applications of length, area, volume, surface of revolution, moments, center of gravity. Improper integrals, Beta-Gamma functions, Numerical Integration using Trapezoidal and Simpsons rules.
IV.Calculus of Functions of Several Variables Partial derivatives, Chain rule, Differentiation of Implicit functions, Exact differentials. Tangents and Normals. Maxima, Minima and Saddle points. Method of Lagrange multipliers. Errors and Approximations. Differentiation under integral sign Jacobians and transformations of coordinates. Multiple Integrals-Double and Triple integrals. Applications to areas, volumes etc.
V.Ordinary Differential Equations: Formation of ODEs, definition of order, degree and solutions. ODEs of first order: Method of separation of variables, homogeneous and nonhomogeneous equations, exactness and integrating factor General linear ODEs of the nth Order: solution of homogeneous and non homogeneous equations, operator method, method of undetermined coefficients and variation of parameters. Solutions of simple simultaneous ODEs .
ETPH 103 Applied Physics-I L T C
2 1 3
Kinematics:
v Need of frames of reference in describing motion
v One Dimensional motion
v Two Dimensional motion
Dynamics
v Central forces, Inverse square force
v Satellite including applications in remote sensing and communication
v Oscillations, General potential with stable equilibrium point, Solution of differential equation with emphasis on initial conditions, Damped and forced oscillations.
Waves
v Waves on a stretched string, Differential equation of wave, Description of general solution f(x+vt) Longitudinal and transverse waves
v Superposition of waves, Plane monochromatic waves, m =nD , plane, spherical and cylindrical wavefronts.
v Pressure equation, decibel, reverberation, ultrasonic
v Optical Instruments Telescope, Microscope, Radio Telescope, Electron Microscope.
v Interference of light Newtons rings, testing of flatness, curved surfaces, alignment.
v Diffraction, Resolution, Polarisation with application
v Principle of laser, design of laser, stimulated radiation, population inversion, laser action, properties and application of laser light.
Modern
physics
v Theory of Relativity
v Elements of Quantum Mechanics including atomic spectra, X-rays, Ultrasound, Infrared radiations, Nuclear radiations and detectors.
ETCH 105 Applied Chemistry -I L T C
2 1 3
I. Solid Fuels : Proximate and ultimate analysis of coal and their importance.
Carbonization: High and Low temperature carbonization,
coke, its manufacture by Otto Hoffman Oven and uses.
II. Liquid Fuels: Conversion of coal into liquid fuels (Bargius process and Fischer Tropsch Process and mechanism, Petroleum: its Chemical composition and Fractional distillation, Cracking of heavy oil residues : thermal cracking and catalytic cracking, knocking-chemical structure and knocking : Octane and Cetane number and their significance, Power alcohol.
III. Gaseous Fuels: Natural gas, producer gas, water gas, carbureted water gas, coal gas and oil gas, fuel and fuel gases and their analysis by Orsats apparatus.
IV. Numerical on calorific value, combustion, Proximate and ultimate analysis of coal and fuel gas analysis.
V. Nuclear Fuels: Nuclear reaction, nuclear fission and nuclear fusion, Nuclear reactor
5.
Solutions : Ideal and non ideal solutions Raoults
Law. Distillation of binary
solutions. Henrys Law, Nernst
distribution law, Arrenius theory and special behavior of strong electrolytes.
ETME 107 Manufacturing Processes L T C
2 2
Casting Processes :
Principles of metal casting: Pattern materials, types and allowance; Study of moulding, sand moulding, tools, moulding materials, classification of moulds, description and operation of cupola: special casting processes e.g. die-casting, permanent mould casting, centrifugal casting, investment casting.
Smithy and Forging:
Basic operation e.g. upsetting, fullering, flattening, drawing, swaging: tools and appliances: drop forging, press forging.
Metal joining:
Welding principels, classification of welding techniques; Oxyacetylene Gas welding, equipment and field of application, Arc-welding, metal arc, Carbon arc, submerged arc and atomic hydrogen welding, Electric resistance welding: spot, seam, butt, butt seam and percussion welding; Flux; composition, properties and function Electrodes; Types of joints and edge preparation, Brazing and soldering.
Sheet Metal Work:
Common processes, tools and equipments; metals used for sheets, standard specification for sheets
Fitting, sawing, chipping, thread cutting (die), tapping; Study of hand tools, Marking and marking tools.
ETCS 109 Introduction to Computers L
T C
2 1 3
1. Introduction :
v Overview of Computer organization and historical perspective computer applications in various fields of science and management.
v Data representation: Number systems, character representation codes, Binary, hex, octal codes and their inter conversions.
v Binary arithmetic, Floating-point arithmetic, signed and unsigned numbers.
v Concept of computing, contemporary, Operating Systems such as DOS, windows 95, UNIX, Client Server Technology, etc. (only brief user level description).
v Introduction to E-mail, ftp, login and other network services, World Wide Web, MS-Word, MS-Excel, MS-Power Point.
Introduction to Programming:
v Concept of algorithms, Flow-charts, Data Flow diagrams etc.
v Introduction to the Editing tools such as vi or MS-VC editors.
v Concepts of the finite storage, bits, bytes, kilo, mega and gigabytes. Concepts of character representation.
Programming using C
The emphasis should be more on programming techniques rather than the language itself. The C Programming language is being chosen mainly because of the availability of the compilers, books and other reference materials.
v Example of some simple C program. Dissection of the program line by line. Concept of variables, program statements and function calls from the library (Printf for example)
v C data types, int, char, float etc.
v C expressions, arithmetic operation, relational and logic operations.
v C assignment statements, extension of assignment to the operations. C primitive input output using getchar and putchar, exposure to the scanf and printf functions.
v C Statements, conditional executing using if, else. Optionally switch and break statements may be mentioned.
v Concepts of loops, example of loops in C using for, while and do-while. Optionally continue may be mentioned.
v One dimensional arrays and example of iterative programs using arrays, 2-d arrays Use in matrix computations.
v Concept of Sub-programming, functions Example of functions. Argument passing mainly for the simple variables.
v Pointers, relationship between arrays and pointers Argument passing using pointers Array of pointers. Passing arrays as arguments.
v Strings and C string library.
v Structures and Unions. Defining C structures, passing strings as arguments Programming examples.
ETEL 111 Communication Skills -I L T C
2 1 3
1.
Remedial Grammar
a) Simple sentences-their phrase structure
b) Parts of speech
c) Tense and Concord
d) Gerunds, Participles and Infinitives
e) Complex and Compound sentences (Use of connectives)
f) Conditional clauses
g) Question tags and short responses
h) Common errors
a) Synonyms and Antonyms
b) One-word substitutions
c) Words often confused
d) Idioms/Idiomatic Expressions
e) Foreign Phrases (Greek and Latin)
Technical description of
a) Simple objects, tools, appliances
b) Processes and operations
c) Scientific principles
Composition:
a) Comprehension unseen passages
b) Precis Writing
Selected prose pieces from prescribed texts
ETEL 113 Impact of Science & Technology L
T C
on Society 2 2
Introduction to some of the important social realities and Institutions in India: interrelationship between Science. Technology: socio-cultural context of Scientific and Technological growth.
History and Science of technology, Impact of technology., Man made hazards, Technology and productivity., Technology and culture, Technology inputs for social change, Technology, economy and social behavior linkages
Stage of Science and Technology in Indian Society today and the policy options for the future.
ETPH 151 Applied Physics Lab-I P C
2 1
v Measurement of short time intervals using electronic timer sensors.
v Study of rotational motion of cycle wheel
v Study of oscillatory systems
v Study of stationary waves
v Use of prism spectrometer
v Measurement of wavelength of light by bi-prism/Newton rings/Diffraction grating
v Diffraction of light using Sodium source and Helium Neon source.
v Study of polarization of light
v Study of laser parameters/diffraction at a circular aperture
v Experiment on Ultrasonic.
ETCH 153 Applied Chemistry Lab-I P C
2 1
To determine the percentage composition of a mixture of Sodium hydroxide and Sodium chloride.
To determine the amount of Sodium Carbonate in the given mixture of Sodium Carbonate and Sodium bicarbonate.
Determine the amount of oxalic acid and Sulphuric acid/Hydrochloric acid in one litre of solution given standard sodium hydroxide and Potassium per magnate.
To determine the carbonate, bicarbonate and chloride contents in irrigation water.
To determine the number of water molecules of crystallization in Mohr salt provided standard dichromate solution using internal indicator.
Determine the amount of Cu in the copper ore solution provided hypo solution
Iodiomatic titration of K2Cr2O7 V/S Na2S2O3 to determine the percentage purity of K2Cr2O7 sample.
Argentometric titration one each of Vohlards method and of Mohrs method.
Determination of dissolved oxygen in the given sample of water
Determine the surface tension of a liquid using drop weight method.
ETCS 155
Introduction to Computer
Lab-I P C
3 1 ½
1+ ½ + 1/3 +________+1/20
F(n)=F(n-1)+F(n-2)for n>2
Write a recursive program to print the first m Fibonacci number
a) Addition of two matrices
b) Subtraction of two matrices
c) Finding upper and lower triangular matrices
d) Trace of a matrix
e) Transpose of a matrix
f) Check of matrix symmetry
g) Product of two matrices.
1 1
2 2 2 2
3 3 3 3 3 3
4 4 4 4 4 4 4 4
5 5 5 5 5 5 5 5 5 5
a) Searching (1) Linear searching
(2) Binary searching
b) Sorting (1) Insartion sort
(2) Selection sorting
ETME 157 Workshop Practice-I P C
3 1 ½
1. Welding
(a) Arc Welding - Butt Joint
- Lap Joint
- T Joint
(b) Gas Welding - Butt Joint
- Lap Joint
- Brazing of Broken pieces
2. Foundry - Pulley Block
- Lathe Stand Block
-
Screw Jack Body
Marking and Finishing the Job
ETME 159 Engineering Graphics Lab P C
2 1
1. General: Importance, Significance and scope of engineering drawing, Lettering, Dimensioning, Scales, Sense of proportioning, Different types of projections, Orthographic Projection, B.I.S. Specifications.
2. Projections of Point and Lines: Introduction of planes of projection, Reference and auxiliary planes, projections of points and Lines in different quadrants, traces, inclinations, and true lengths of the lines, projections on Auxiliary planes, shortest distance, intersecting and non-intersecting lines.
3. Planes other than the Reference Planes: Introduction of other planes (perpendicular and oblique), their traces, inclinations etc., Projections of points and lines lying in the planes, conversion of oblique plane into auxiliary Plane and solution of related problems.
4. Projections of Plane Figures: Different cases of plane figures (of different shapes) making different angles with one or both reference planes and lines lying in the plane figures making different given angles (with one of both reference planes). Obtaining true shape of the plane figure by projection.
5. Projection of Solids: Simple cases when solid is placed in different positions, Axis faces and lines lying in the faces of the solid making given angles.
6. Development of Surface: Development of simple objects with and without sectioning.
7. Isometric Projection
8. Nomography : Basic Concepts and use.
ETMA 102 Applied
Mathematics-II L T C
3 1 4
Inner product spaces, Matrices and determinates, Linear
transformations. Systems of linear
equations-consistency and inconsistency, Hermitian, Skew-Hermitian Forms,
Eigenvalues and Eigenvectors of matrix, diagonalization of a matrix,
Cayley-Hamilton Theorem (without poof)
Complex Variables: Curves and Regions in the Complex Plane, Complex Functions, Limits, Derivative, Analytic Function, Cauchy-Riemann Equations, Laplaces Equation, Rational, Exponential, Trigonometric, Hyperbolic Functions Linear Fractional Transformations, Conformal Mapping, Complex Line Integral, Cauchys Integral Theorem, Cauchys Integral Formula, Derivatives of Analytic Function, Power Series, Taylor Series, Laurent Series. Methods for obtaining Power Series, Analyticity at Infinity, Zeroes, Singularities, Residues, Residue Theorem, Evaluation of Real Integrals.
1. Vector Calculus: Scalar and vector fields, Curves, Arc length, Tangent, Directional Derivative, gradient of Scalar field, divergence and curl of a vector field. Line integrals (independent of path,) Greens theorem, Divergence theorem and Stokes theorem (without proofs), Surface Integrals.
2. Probability and Statistics : Random Variables, Discrete and Continuous Distribution, Mean and Variance of a Distribution, Moment Generating Functions, Skewness, Kurtosis, Binomial, Poisson, Normal Distributions, Testing of Statistical Hypothesis, F Test, T-Test, X2 test.
ETPH 104 Applied
Physics-II L T C
2 1 3
1. Heat: Temperature measurement and controls, Resistance thermometer, thermo
emf, high and Low temperature measurements, thermistor, thermostatic and other temperature control devices. Black body radiation, Kirchoffs Law, Stefan-Boltzmans Law, Wiens Law, Rayleigh jeanss Law, Plancks Law.
2. Ultrasonic: Piezo-electric effect, production-(using Quartz, Ceramics and Magnetostriction), Detection, velocity measurement and application of ultrasonic waves (cavitations, thickness, Echo, chemical reactions).
3. Motion of charged particle in Electric and magnetic fields. Magnetic and electrostatic focussing, Determination of e/m by cathode ray tube, Functions and block diagram of CRO Positive rays, Thomson parabolic method, Isotopes, Mass spectrograph (Aston and Bainbridge). Cyclotron.
4. Semiconductors and Electronics: Characteristics of p-n junction, static and dynamic resistance, Zener diode and LED, diode as a rectifier, Transistor (pnp and npn) characteristics, Current and voltage gain.
5. Solid State Physics: Crystal structures, X-Ray diffraction, Superconductivity, Meissner effect, London Equation, BCS theory, Properties and applications of super conductors.
6. Fibre Optics: Type of fibres, step index and graded index, Numerical aperture,
Uses of Optical fibres in communication.
7. Heisenberg uncertainty principle, de Broglies hypothesis (matter waves), Davisson and Germer expt., Development of Schrodinger wave equation, solution of the Sch. Wave eqn for free and bound state, Sch. Wave eqn applied to Metals & Semiconductors, Vector atomic model, Paulis spin quantum numbers, Stem Garlach expt, Electro-optical Effect (Stark effect), Magneto-optical effect (Zeeman effect)
8. Basic introductory concepts of creation of Universe: Big Bang, Steady state, Pulsating state, Quasars, Pulsars, Black hole
ETCH 106 Applied
Chemistry-II L T C
2 ½ 2 ½
1. Chemical Bonding: Ionic bond energy changes, lattice energy Born Haber Cycle, Covalent bond-energy changes, Potential energy curve for H2 molecule, characteristics of covalent compound, co-ordinate bond-Werners Theory, effective atomic numbers, isomerism in coordinate compounds. Hydrogen bonding, Vander Waals forces, hybridization and resonance, Valence Shell Electron Repulsion theory (VSEPR). Discussion of structures of H2O, NH3, BF3 SiF4, Molecular orbital theory, Linear combination of atomic orbitals (LCAO) method. Structure of simple homo nuclear diatomic molecule like H2, N2, O2, F2
2. Gaseous State: Gas Laws and kinetic theory of gases, Distribution of Molecular velocities, mean free path. Real gases-non ideal behaviours, Causes of deviation from ideal behaviour Vander Waals equation. Liquefaction of gases.
3. Thermochemistry: Hesss Law, heat of a reaction, effect of temperature on heat of reaction at constant pressure (Kirch offs Equation), heat of dilution, heat of hydration, heat of neutralization and heat of combustion, Flame temperature.
4. Catalysis: Criteria for Catalysis- Homogeneous Catalysis, acid-base, Enzymatic catalysis, Catalysis by metal salts, Heterogeneous Catalysis-concepts of promoters, inhibitors and poisoning, physiosorption, Chemisorption, Surface area, Industrially important process, Theories of Catalysis.
5. Plastic: Thermosetting and Thermoplastic, properties and applications. Conducting Polymer-properties and application.
6. Composites: Classification, micro-mechanics of fibre and particle reinforced composites, strength, stiffness and factors affecting failure modes.
ETCS 108 Programming
and Auto CAD L T C
2 2
1. Programming using C++ Identifiers and keywords, constants, operators, type conversion, conditional expressions, loops statements, breaking loop statements, functions, preprocessor directives, arrays, pointers, structures.
2. Object Oriented Programming: Classes and structure, constructors, destructors, inheritance, function overloading, operator overloading, polymorphism, binding, virtual functions, pure virtual functions opening and closing of file, classes and file operations.
3. Use of Auto CAD for Engineering drawing practices and graphic problems.
4. Internet Technologies, World Wide Web, electronic mail, internet protocols, news, FTP, telnet, gopher, archie, TCP/IP, SMTP, HTTP, HTML, search engines, Audio & Video teleconferencing, practical examples using DHTML and Static HTML, languages used for WEB Technology.
ETME 110 Engineering Mechanics L T C
3 1 4
1. Force system: Free body diagram, Eqilibrium equations and applications.
2. Structure: Plane truss, perfect and imperfect truss, assumption in the truss analysis, analysis of perfect plane trusses by the method of joints, method of section and graphical method.
3. Friction: Static and Kinetic friction, laws of dry friction, co-efficient of friction, angle of friction, angle of repose, cone of friction, friction lock, friction of flat pivot and collared thrust bearings, friction in journal-bearing, friction in screws, Belt drive- derivation of equation.
T1/T2 =emq and its application
4. Distributed Force: Determination of center of gravity, center of mass and centroid by direct integration and by the method of composite bodies, mass moment of inertia and area moment of inertia by direct integration and composite bodies method, radius of gyration, parallel axis theorem, Pappus theorems, polar moment of inertia.
5. Kinematics of Particles: Rectilinear motion, plane curvilinear motion-rectangular coordinates, normal and tangential component.
6. Kinetic of Particles: Equation of motion, rectilinear motion and curvilinear motion, work energy equation, conservation of energy, impulse and momentum conservation of momentum, impact of bodies, co-efficient of restitution, loss of energy during impact.
7. Kinematics of Rigid Bodies: Concept of rigid body, type of rigid body motion, absolute motion, introduction to relative velocity, relative acceleration (Coriolis component excluded) and instantaneous center of velocity, Velocity and acceleration polygons for four bar mechanism and single slider mechanism.
8. Kinetics of Rigid Bodies: Equation of motion, translatory motion and fixed axis rotation, application of work energy principles to rigid bodies conservation of energy.
9. Material Testing: Tensile, torsion, hardness and impact testing, creep and fatigue-factors affecting ; ductile and brittle behavior and transition temperature.
ETEC 112 Electrical
Science L T C
3 1 4
1. Properties of Conductors and Insulators:
Basic laws of Electrical Engineering
Temperature Resistance Coefficients
2. D.C. Circuits
Network theorems and applications
Division of current
Circuit Parameters
Energy and Power
Superposition Theorem
Thevenin and Reciprocity theorems
Star Delta Transformations
3. Alternating
Currents
Power and Power factor
Resistance, Inductance and Capacitance
Resonance
Q Factor
4. Electromagnetism
Magnetic Induction
Hysteresis
Moving Coil and Moving Iron Instruments, Various types of bridges for measuring resistance, capacitance, Inductance, Galvanometers
5. D.C. Generators & Motors
Principle of Operation of Generators & Motors
Speed Control of Shunt motors
Flux control, Rheostatic control, and voltage control
6. A.C. Generators & Motors
Principle of Operation
Revolving Magnetic Field
Starting of Induction motors
Director on line and Star Delta starters
Synchronous Machines
Construction
Regulation and Efficiency calculations
Open and short circuit tests.
ETEL 114 Communication Skills-II
L T C
1 ½ 1 ½
2. Writing: Selecting material for expository, descriptive, and argumentative pieces; business letters; formal report; summarizing and abstracting; expressing ideas within a restricted word limit; paragraph division, introduction and the conclusion; listing reference material, use of charts, graphs and tables; punctuation and spelling; semantics of connectives, modifiers and modals; variety in sentences and paragraphs.
3. Reading Comprehension: Reading at various speeds (slow, fast, very fast); reading different kinds of texts for different purpose (e.g. for relaxation, for information, for discussion at a later stage, etc.); reading between the lines.
4. Speaking: Achieving desired clarity and fluency; manipulating paralinguistic features of speaking (voice quality, pitch, tone, etc.) pausing for effectiveness while speaking ,task oriented, interpersonal, information and semiformal speaking; making a short classroom presentation.
5. Group Discussion: Use of persuasive strategies including some rhetorical devices for emphasizing (for instance; being polite and firm; handling questions and taking in criticism of self; turn-taking strategies and effective intervention; use of body language).
6. Listening Comprehension: Achieving ability to comprehend material delivered at relatively fast speed.
ETPH 152 Applied
Physics Lab-II P C
2 1
method, Stefans Constant, Emissive Power.
ETCH 154 Applied
Chemistry Lab-II P C
2 1
ETCS 156 Programming
and Auto CAD Lab P C
3 2
(a) Strcat ( )
(b) Stremp ( )
9. A time expressed in hours, minutes, seconds can be expressed in hours only (as a real, number), Declare a class to store the time as a real number, with member functions to read the time and display the same in hours, minutes and seconds. Use friend class to use the function.
10. It is required to read a real number and display its square, square root, cube root. Use a virtual function to display any one.
11. Write a program for binary search using strings.
12. Use of Drawing & Editing Properties: Modify Object Properties and a know how of layers, colors and prototype drawing.
13. Draw line (Poly line, multi line, linear line), polygon, ellipse, circle, arc, rectangle and use cross hatching, regions, boundary, spline, donut, fillet and extent commands.
14. Dimensioning commands, styles, control scale factors, drawing set-up, grip editing objects snaps, utility commands.
15. Projection of points, lines and solids
16. Section of Solids
17. Development and Intersection of Surface
18. Isomeric Projections
19. Create a WEB page containing hyperlinks to the pages having information about Science and Technology.
ETME 158 Engineering
Mechanics Lab P C
2 1
ETEC 160 Electrical Science Lab P C
2 1
ETMA 201 Applied
Mathematics-III L T C
3 1 4
ETEC 203 ANALOG ELECTRONICS I L T C
3 1 4
Semiconductor Diodes and Rectifiers:
Introduction, general characteristics, energy levels, extrinsic materials n & p type, ideal diode, basic construction and characteristics, DC & AC resistance, equivalent circuits, drift & diffusion currents, transition & diffusion capacitance, reverse recovery times, temperature effects, diode specifications, different types of diodes (Zener, Varactor, Schottky, Power, Tunnel, Photodiode & LED). Half wave & full wave rectifiers.
Switched Mode Power Supply
Bipolar junction transistor:
Introduction, Transistor, construction, transistor operations, BJT characteristics, load line, operating point, leakage currents, saturation and cut off mode of operations Eber-molls model.
Bias stabilization:
Need for stabilization, fixed Bias, emitter bias, self bias, bias stability with respect to variations in Ico, VBE & b, Stabilization factors, thermal stability.
Small signal amplifiers:
CB, CE, CC configurations, hybrid model for transistor at low frequencies, RC coupled amplifiers, mid band model, gain & impedance, comparisons of different configurations, Darlington pair, Hybrid p-model at high frequencies, Cascaded amplifiers.
Multistage Amplifiers: Cascaded amplifiers, Calculation of gain Impedance and bandwidth, Design of multistage amplifiers.
Feedback Amplifiers: Feedback concept, Classification of Feedback amplifiers, Properties of negative Feedback amplifiers, Impedance considerations in different Configurations, Examples of analysis of feedback Amplifiers
Field Effect Transistor:
Introduction, Classification, FET characteristics, Operating point, Biasing, enhancement & Depletion type MOSFETS.
ETEC 205 Circuits
& Systems L T C
3 1 4
ETCS 207 Foundations of Computer Science L T C
3 1 4
ETCS 209 OBJECT ORIENTED PROGRAMMING
L T C
3 1 4
Review of C++ as Oriented Programming Language.
Introduction to Java: Features of Java, Data types, Control Statements,
identifiers, arrays, operators.
Inheritance: Multilevel hierarchy, method overriding, Abstract classes,
Final classes, String Class.
Packages and Interfaces: Defining, Implementing, Applying Packages and
Interfaces, Importing Packages.
Exception Handling: Fundamentals, Types, Uncaught Exceptions, Multiple
catch Clauses, Javas Built-in Exception.
Multithread Programming: Creating,
Implementing and Extending thread, thread priorities, synchronization
suspending, resuming and stopping Threads
String Handling : Constructors, Various Types of String Operations.
Exploring Various Basic Packages of Java:
Java.lang, Java. util, Java.i.o
Event Handling: Mechanism, Event Model, Event
Classes, Sources of Events, Event Listener Interfaces
AWT: Working with Windows, AWT Controls,
Layout Managers
Applets: Class, Architecture, Skeleton,
Display Methods.
Swings: Japplet, Icons, labels, Text Fields, Buttons, Combo Boxes.
Networking: Networking Basics, Java and the
Net, Inet Address TCP/IP Client Sockets
Servlets : A Simple Servlet, The Servelt
API, The javax.servlet Packages,
Reading Servlet parameters, Reading Initializations Parameters, The
javax.servlet.http Package, Handling HTTP Requests and Responses
RMI {Remote Method innovation}: A Simple
Client/Server Application Using RMI Introduction To Beans and Enterprise Java
Beans.
ETCS 211 Data Structures L T C
3 1 4
Problem solving approaches, Structured Programming Concepts, Guidelines for good Program Structure
Arrays, Order List, Multidimensional arrays and their storage in contiguous memory, sparse matrices, Stacks and queue implementation using arrays, Linked list (singly, doubly and circular linked list), Stacks and queue implementation using linked list, Polished expression, Conversion of infix to postfix, Infix to prefix conversion, (and vice versa), Prefix to Postfix conversion using Stacks, Polynomial representation using linked list and basic operation.
Trees: Definition and concepts, Properties, representation, operations (traversal algorithm)
Graphs: Definition and concepts, Properties, representations, operations (traversal algorithm), spanning trees.
Sorting: Concepts, Selection sort, Double sort, Merge sort, Merge sort, Partition Exchange sort, Shell Sort.
Searching : Sequence searching, Binary Searching, Search Trees, height balanced trees, hash function, hashing table, collision resolution techniques.
File Structures: Sequential File, Index sequential file, Hashed index, Tree index, Random File, Linked organization of file, inverted file.
ETEC 251 Analog Electronics I Lab P C
2 1
The practical will be based on the Analog Electronics-I (ETEC-203)
List of the Experiments
(i) Subtractor
(ii) Adder in both inverting & non-inverting modes
ETEC 253 Circuits and Systems Lab P C
2 1
The practicals will be based on Circuits and Systems (ETEC 205)
ETCS 255 Object Oriented Programming Lab P C
2 1
The practicals will be based on the Object Oriented Programming (ETCS 209)
ETCS 257 Data
Structures Lab. P C
2 1
The practicals will be based on the cource Data Structure (ETCS 211)
ETEC 202 ELECTROMAGNETIC FIELDS AND TRANSMISSION LINES
L T C 3 1 4
Mathematical
Orientation Circuits and Fields, Vector Analysis, Physical Interpretation of
Gradient, Divergence and Curl, Vector Relations in other Co-ordinate Systems,
Integral, theorems, The Direct Delta, Matrices.
Electrostatics : Fundamental Relations of the electrostatic Field, Gausss Law, The potential Functions, Field due to a continuous distribution of charge, Equipotential surfaces, Divergence Theorem, Poissons Equation and Laplaces Equation, Capacitance, Electrostatic Energy, Conditions at a Boundary between Dielectrics, Dirac Delta Representation for a Point Charge, Dirac Delta Representation for an infinitesimal Dipole.
Magnetostatics: Magnetic Induction and Faradays Law, Magnetic Flux Density, Magnetic Field Strength H, Ampere, Gauss Law in the Differential Vector Form, Permeability, Energy Stored in a Magnetic Field, Amperes Law for a Current Element, Volume Distribution of Current and the Dirac Delta, Amperes Law Force Law, Magnetic Vector Potential, The Far Field of a Current Distribution.
Maxwells Equations: The Equation of Continuity for Time Varying Fields, Inconsistency of Amperes Law, Maxwells Equations, Conditions at a Boundary Surface.
Electromagnetic Waves: Solutions for Free-space conditions, Uniform Plane-wave Propagation, Uniform Plane Waves. The Wave Equations for a Conduction Medium, Sinusoidal Time Variations, Conductors and Dielectrics, Polarization, Direction Cosines, Reflection from different media, Surface Impedance, The Transmission-line Analogy, Poyntings Theorem
Transmission Lines: Transmission Line equation, characteristic
impedance, propagation constant, attenuation and phase constant, computation of
primary and secondary constants, line distortion, Loading of line, artificial
lines, reflection coefficient, V.S.W.R., reflection loss, efficiency of
transmission, U.H.F. Lines-Smith chart, Quarter wave transformer, single and
double stub matching U.H.F. lines as circuit elements,
Equalizers-classification, inverse networks, Lattice and Bridge T attenuator
equalizers phase equalizer, Attenuator-Symmetrical and asymmetrical, Bridge T
and Ladder attenuator, variable attenuator.
ETEC 204 ANALOG ELECTRONICS-II L T C 3 1 4
Building Blocks of Analog ICs: Differential amplifier, Op-amp Model, op-amp parameters, virtual ground, Inverting and non-inverting amplifiers, differential amp, adders, Voltage to current, current to voltage Converter, Integrators, Differentiators Current mirrors, Active loads, Level shifters and output stages
Waveform Generations: Sinewave generator(Phase shift Wein bridge, Hartley & Colpitts), Ramp an sawtooth generators, Linearity of waveforms, Astable multi Vibrators, OTA-C Oscillators, Voltage controlled-oscillators.
Power Amplifiers: Power dissipations in transistors, Harmonic distortion, Amplifiers Classification, (Class-A, Class-B, Class-C, Class-AB) Efficiency, Push-pull and complementary Push-pull amplifiers, Tuned amplifiers.
Linear & Non Linear Waveshaping: Clipping & Clamping Circuits Comparators, log/antilog circuits using Op-amps, precision rectifiers.
Active RC Filters: Idealistic & Realistic response of filters(LP, BP, HP), Butter worth & Chebyshev filter functions All pass, Notch Filter, Operational transconductance amplifier (OTA)-C filters.
Applications of IC Analog Multiplier: IC phase locked loops, IC voltage regulators, IC function generators.
ETEC 206 DIGITAL CIRCUITS & SYSTEMS-I L T C 3 1 4
Analog & Digital signals, AND, OR, NOT,NAND, NOR & XOR gates, Boolean algebra.
Standard representation of Logical functions, K-map representation and simplification of logical functions Dont care conditions, X-OR & X-NOR simplification of K-maps
Combinational circuits: Multiplexers, demultiplexers, Decoders & Encoders, Adders & Subtractors, Code Converters, comparators, decoder/drivers for display devices, Logic Implementations using ROM, PAL, & PLA.
Flip Flops: S-R, J-K, D&T filp-flops, excitation table of a flip-flop, race around condition.
Sequential circuits: Shift registers, Ripple counter, Synchronous counters.
555 Timer and its application as mono-stable and astable multi-vibrator, A/D and D/A converters.
TTL and CMOS Logic families
Semiconductor Memories: Memory organization & operation, classification and characteristics of memories, RAM,ROM and content addressable memory
ETEC 208 COMMUNICATION SYSTEMS & CIRCUITS L T C 3 1 4
1. Analog Modulation:
Amplitude Modulation
Generation & Demodulation of AM waves, DSBSC waves, Coherent Detection of DSBSC Signal, Quardrature-Carrier Multiplexing, Generation of SSB waves, Demodulation of SSB waves.
Angle
Modulation:
Frequency & phase Modulation, narrow & Wide-Band FM, BW of FM waves, Generation & Demodulation of FM waves, S/N ratio, Comparison of AM, FM &PM.
Random Process
Probability, Random variable, probability density, mean, moments, transformation of random variables, Stationary Process, mean, autocorrelation and covariance functions, ergodicity, power spectral density, response of linear systems to random signals, Gaussian distribution, central limit theorem.
Pulse
analog Modulation:
Sampling theorem, Sampling of Low Pass and band pass signals, Aliasing, Aperture effect, PAM, PWM and PPM generaton and demodulation, TDM, Cross talk, Spectral analysis of PAM, PWM and PPM Waves, S/N ratio for different pulse modulation.
Pulse-Digital
Modulation:
Pulse Code modulation signal to quantization noise ratio, Companding, probability of error for PCM in AWGN Channel, DPCM, DM and ADM modulators and demodulators, Prediction Filter, line coding, Inter symbol Interference.
Digital transmission through Career Modulation
Amplitude, Frequency and phase shift keying, Differential phase shift keying, CPFSK, MSK QPSK and QAM modulation & detection, probability of error calculation, Matched Filter.
Introduction
to Information Theory:
Measurement of Information, mutual information Shannons Theorem Sowzce coding, channel coding and channel capacity theorem. Huffman code, Lempel ziv code.
ETCS 210 COMPUTER GRAPHICS AND MULTIMEDIA L T C 3 1 4
Basic raster graphics, algorithms for drawing 2 D Primitives lines, circles, ellipses, arcs, clipping, clipping circles, ellipses & polygon.
Polygon Meshes in 3 D, curves, cubic & surfaces, Solid modeling.
Geometric Transformation: 2 D, 3 D transformations, window to viewport transformations, achromatic and color models.
Graphics Hardware: Hardcopy & display techniques, Input devices, image scanners
Shading Techniques: Transparency, Shadows, Object reflection, Gouraud & Phong shading techniques. Visible surface determination techniques for visible line determination, Z-buffer algorithm, scanline algorithm, algorithm for oct-tres, algorithm for curve surfaces, visible surfaces ray-tracing, recursive ray tracing, radio-city methods.
Image manipulation & storage: File formats for BMP, GIF, TIFF, IPEG, MPEG-II, & Introduction to animation techniques.
Elementary filtering techniques, elementary Image Processing techniques, Geometric & multi-pass transformation mechanisms for image storage & retrieval.
Procedural models, fractals, grammar-based models, multi-particle system, volume rendering.
ETCS 212 - OPERATING SYSTEMS AND SYSTEM PROGRAMMING-I L T C 3 1 4
Overview:
Importance of
Operating Systems (highlightening the salient features of UNIX) Basic Concepts and Terminology used in OS
Functions performed by OS (using case study of UNIX)
Memory Management:
Single Contiguous
Allocation: H/W Support, S/W Support,
Advantages, Disadvantage: Introduction to Mutiprogramming : Concept of
Multiprogramming, Measure of System i/o Wait Percentage, Relevance of
Multiprogramming to Memory Management;
Partitioned Allocation, Relocatable Partitioned Memory management, Paged
Memory management, Demand-Paged Memory management, Segmented Memory Management,
Segmented and Demand-Paged Memory Management, Other Memory management Schemes
(Swapping, Overlays).
Processor Management:
State Model: Job Scheduler, Process Scheduling, Job and
Process Synchronization, Structure of Processor Management; Job Scheduling: Functions, Policies, Job
Scheduling in Nonmultiprogrammed Environment,
Job Scheduling in multiprogrammed environment ; Process Scheduling,
Multiprocessor Systems: Separate
Systems, Coordinated Job Scheduling, Master/Slave Scheduling, Homogeneous
Processor scheduling ;
Process Synchronization : Race Condition, Synchronization Mechanism,
Deadly Embrace, Synchronization Performance Considerations.
Device Management: Techniques for Device Management: Dedicated Devices, Shared Devices, Virtual Devices; Device Characteristics-Hardware Considerations: Input or
Output Devices, Storage Devices; Channels and Control Units: Independent Device Operation, Buffering, Multiple Paths, Block Multiplexing; Device Allocation Considerations; Virtual Devices.
Information Management: Introduction; A Simple File System; General Model of a File System; Symbolic File System; Basic File System, Access Control Verification; Logical File System; Physical File System.
ETEC 252 Analog Electronics-II lab P C
2 1
The practical will be based n the Analog Electronics-II Papers
(ETEC-204)
LIST OF EXPERIMENTS
ETEC 254 Digital Circuits & Systems-I Lab P C
2 1
The practicals will be based on Digital Circuits and Systems-I
(ETEC-206)
LIST OF EXPERIMENTS
1.
To verify Truth
table (OR, NOR, NAND, EX-OR)
2.
To verify Truth
table of half and full adder and subtractor
3.
To verify RS
Flip flop
4.
To verify JK/D
Flip flop
5.
To design
Binary counter
6.
To design
Synchronous counter
7.
To design
Ripple counter
8.
To convert BCD
number in to Excess-3 form
9.
To design
Decade counter
ETEC 256 Communication Systems and Circuits Lab P C
2 1
The practicals will be based on Communication Systems and
Circuits (ETEC-208)
ETCS 258 Computer Graphic & Multimedia Lab P C
2 1
The practicals will be based on Computer Graphic &
Multimedia (ETCS-210)
ETCS 260 Operating Systems & System Programming-I Lab P C
2 1
The practicals will be based on Operating System & System
Programming-I (ETCS-212)
ETEC 301 DIGITAL CIRCUITS & SYSTEMSII L T C 3 1 4
Introduction:
Hardware development language:
VHDL Review of sequential
circuits. State tables, state diagrams,
State Assignment, Digital system design with state Diagrams, Design of Digital
Circuits (with Hard Ware Programming Language) like counters, multiplexers,
demultiplexers code converters, memory interfaces for DRAM, Timing Diagrams
etc. Introduction to the design of 8-bit Processor. PLD Devices PROM, PAL, EPLD, like, GAL, FPLA, FPGA, etc. and
their applications. FPGA Programming.
Design exercises like a watch and other digital systems ,ASIC design
using CAD tools. Concepts of ASM and
realization through Gate, MUX, PLD
Design of FSM/Microprocessor through Algorithmic state machine concept.
Concept of ASMs
realizations through GATES, MUX, PLD devices.
Design of FSM
/Microprocessor through Algorithmic
State Machine concept.
Overview of at
least one assembler/compiler like ABEL,
PALASAM, VERILOG, SYNOPSIS etc.
ETEC 303 MICROPROCESSOR SYSTEM-I L T C 3 1 4
Introduction to Microprocessors and microcomputers. Study of 8 bit Microprocessor, its internal architecture, addressing modes, Microprocessor programming System timing, Various data transfer schemes. Interfacing with memory (ROM,SRAM,DRAM etc.) Cache controller and cache memory system. Input/Output Interface (Chips like 8212, 8255, 8155,8279,8237 etc.) Interrupts and their processing, 8259, Interrupt interface circuits using 8259. Microcontrollers Interfacing techniques with A/D, D/A, stepper
motor, printer, keyboard, output displays etc. Introduction to 16/32, bit processor, Real mode, virtual 808 Protected mode.
ETCS 305 COMPUTER ARCHITECTURE L
T C 3 1 4
Register Transfer
and Microoperations : Register Transfer language register transfer, Bus and
memory transfers, Arithmetic Microoperations, Logic micro operation, shift
micro operations, ALU Design
Bus based architecture, IBM PC , EISA, PCI, VME bus, RS 232, IEEE 488, RS-422, RS-485, IEEE 1394 Peripheral Devices, Device Drivers, IDE driver for HDD, communication in inter parallel ports, Kernel and Device Drivers, Power PC Architecture, Information representation, Instruction formats, Instruction types, ALU Design Instruction sequencing and Interpretation, Hardwired control, Micro programmed virtual memory, Parallel processing, Pipe line processing, Multiprocessing, IBM PC architecture, comparison of SISC and RISC Architectures.
ETEC 307 TELECOMMUNICATION NETWORKS L T C 3 1 4
Evolution of Tele-Communication Networks, Basic
Switching System, Simple Tele-phone Communication, Brief Introduction to
Electromagnetic Exchanges, Electronic Switching Space Division Switching
Stored Programme Control Centralized SPC, Distributed SPC, Software
Architecture, Application Software Enhanced Services, Multi Stage Switching
Networks.
Speech Digitization, Quantization Noise,
Compounding, Differential Coding, Delta Modulation, Vocodors, Pulse
Transmission on Transmission line concepts, Line Coding, NRZ and RZ Codes,
Manchester Coding, AMI Coding, Walsh Codes, TDM,
Time Division Switching Time Division space
switching, Time Division Time Switching, Time multiplexed space switching, Time
multiplexed Time Switching, Combination Switching.
Traffic Engineering, Grade of Service and Blocking
Probabity Telephone Networks, Subscriber Loops, Switching Hierchy and
Routing, Transmission Plans and Systems, Signaling Techniques, In Channel,
Common Channel.
Access Technology;
WLL, (Wire less loop), ADSL (Asymmetrical Digital Subscriber Loop) AVCC(
Advanced Intelligent Network), BMFB
Wired, Wireless, broadcast, point to point, Satellite
medium-SCPC, VSAT broadcast medium etc, link budget analysis, Link behavior,
Peburst, error, Optimum packet size, error control, Elementary coding ideas ,
ATM transport mechanism, ISDN.
ETCS 309 DATA BASE MANAGEMENT SYSTEM L T C 3 1 4
Introduction : Concept and
goals of DBMS, Database Languages, Database Users, Database Abstraction.
DBMS models: Basic Concepts of ER Model, Relationship
sets, Keys, Mapping, Design of ER Model
Hierarchical model: Concepts, Data
definition, Data manipulation and implementation.
Relation Model: Relational
database, Relational Algebra, Relational Calculus
Network Model: Network Data
Model, DBTG Set Constructs, and Implementation.
Relational Database Design and Query Language : SQL, QUEL, QBE,
Normalization using Functional Dependency, Multivalued dependency and Join
dependency.
Concurrency Control: Lock Based
Protocols, Time Stamped Based Protocols, Deadlock Handling, Crash Recovery.
New Applications: Distributed Database, Objective
Oriented Database, Multimedia Database,
Data Mining, Digital Libraries.
ETEC 351 -
DIGITAL CIRCUITS & SYSTEMS II Lab P C 2 1
Experimental work based upon the course Digital Circuits & Systems-II (ETEC 301)
ETEC 353 MICROPROCESSOR SYSTEM I LAB P C 2 1
Experimental work based upon the course Microprocessor System-I ( ETEC 301)
ETCS 355
COMPUTER ARCHITECTURE LAB P
C 2 1
Experimental work based upon the course computer Architecture (ETCS 305)
ETCS 357 -
TELECOMMUNICATION NETWORKS LAB P C 2 1
Experimental work based upon the course Telecommunication Networks ( ETEC 307)
ETCS 359 DATA BASE MANAGEMENT SYSTEM LAB P C 2 1
Experimental work based upon the
course Data Base Management System (ETCS 309)
ETCS 361 -
PROGRAMMING I LAB (OR CAD) OR P C
ANY OTHER SIMILAR PCB DESIGN SOFTWARE LAB 2 1
ETCS 363 PRACTICAL TRAINING P C - 2
ETEC 302 MICROPROCESSOR SYSTEM-II L T C 3 1 4
Review of 16/32 bit Microprocessor (8086,8088, 80186, 80286 DX, 80286 SX, 80286 SL, 80386, 80486, 80586 etc.) Review of RISC, CISC architectures. Architecture of 8086/8088, addressing modes and instruction set of 8086. Memory segmentation,
Assembler and Debugger, System design , PC architecture, 8088 PC/XT Microcomputer system, PC/AT System, various bus protocols like IBM bus, EISA, VESA, EURO, local etc. Multiprocessing, Numeric data processor and its interfacting.
Introduction to bit slice processor, Signal processing processors and Transputers. Introduction to Development Tools : MDS, Logic analyzer, in circuit emulators. Introduction to a typical Mother Board design using CAD tools.
ETEC 304 MICROWAVE ENGINEERING: L T C 3 1 4
Review of Maxwells equations
Wave Guide: Rectangular, cylindrical wave guide solution of wave equation, modes, propagation properties, power transmission, power losses in wave guides, choice of Excitation of modes.
Microwaves: Introduction, areas of applications,
Components & Elements: Joints, Bends and Irises. Posts and screws, Cavity Resonators, Hybrid couplers, Isolator, Circulator, Attenuator, Frequency meter, short-circuit, Phase shifter, S-parameters.
Microwave Tubes: Klystron Amplifier, Reflex-Klystron, Magnetron TWT, CFA, Gyrotrons, Microwave Ovens.
M/W Solid-State Devices & MICS: M/W Bipolar Transistor, FETS, Varactor and Step-Recovery Diodes, Parametric Amplifiers, Tunnel Diode, Gunn Diode, Read Diode, Impatt, Trapatt, Pin Diode, Schottky Diode, Backward Diode, introduction to MIC, Stripline and Microstrips, Fabrication of MICs etc., MASERS and LASERS.
Introduction to Microwave Detectors, Mixers Switches, Microwave Measurements Microwave filters.
Introduction to Radar.
ETEC -306 DIGITAL SIGNAL PROCESSING L T C 3 1 4
Sampling of signals in time and frequency domain; Convolution,
Correlation, Hilbert Transform, Discrete Fourier Transform, Fast Fourier
Transform; Bilinear Transformation; Stability, FR and IIR filters; Structure of
digital filters; Windows, Effect of finite word length in Digital filters;
algorithms for optimization and design of digital filters.
ETEC- 308 DATA COMMUNICATION NETWORKS L T C 3 1 4
Introduction: Data Networks, WAN, MAN, LAN
Data Transmission in PSTNs. Modem, ASK, FSK, PSK, QAM, Modulator,
Demodulator, Switching Tehniques for Data Transmission, :- Circuit Switching, Store and Forward
Switching Message switching, Packet Switching, Data gram service, Virtual
Circuit Service, Data Communication Architecture, ISO-OSI Reference Model, PDU,
IDU, SDU, SAP Link to Link layers, Physical Layer, Data Link layer, Network
layer, Transport layer, Session Layers, Presentation layers, (Encryption,
Decryption )- Application layer :-
Satellite Based Data Networks
Typical application areas of LAN
LAN Technologies - Transmission, Topology, Access methods
Multiple Access Bus LAN CSMA, Token Passing
Ring LAN, Token Passing Bus LAN
Metropolitan Area Networks:- Data Network
Standards, Protocol Stacks, MAP, TOP, LAP
Internetworking:- Introduction to ISDN.
Introduction to telemetry and telecontrol
-telemetry links-telemetry error.
Classification of signals-their suitability
for telemetry, Analog and digital telemetry.
Telemetry and carrier communication
systems-distinction and design criteria overview of modulation techniques-AM,
FM and PM, suitability for wire and wireless telemetry, power-line carrier
communication.
ETEC 310 V L SI DESIGN L T C 3 1 4
Evolution of VLSI. MOS
Devices and Circuits, MOS Transistors-Depletion and enhancement mode
transistors, Transistor as a Switch, MOS inverter, inverter delay, Parasitic
effects Pull up/Pull-down ratios for inverting logic. Basic NAND, NOR, XOR, and XNOR gates, multiplexes, Memory, bars
transistors, super buffers, NMOS combinational Network with bars transistors
and inverters, PLAs clocked logic, two-phase clock, register stage,
Introduction to CMOS gates.
Processing Technology,
Explanation of different stages in fabrication.
Design Methodology, Steps
in the Design of a VLSI, VLSI design tools.
ETEC 352
MICROPROCESSOR SYSTEM-II L T C 3 1 4
Experimental
work based upon the course Microprocessors
System-II (ETEC 302)
ETEC 354 MICROWAVE ENGINEERING LAB P C 2 1
Experimental
work based upon the course Microwave Engineering (ETCS-306)
ETEC 356- DIGITAL SIGNAL PROCESSING LAB P C 2 1
Experimental
work based upon the course Digital Signal Processing (ETCS 306)
ETEC 358-DATA COMMUNICATION NETWORKS LAB P C 2 1
Experimental
work based upon the course Data Communication Networks (ETEC 310)
ETEC 360- VLSI DESIGN LAB P C 2 1
Experimental
work based upon the course VLSI Design
(ETEC 310)
ETEC 401 CONTROL SYSTEMS L T C
3 1 4
Different forms of control with industrial control
examples; transducers, controllers and actuators, mathematical models,
Differential equations, Difference equations and their solutions. Laplace Transforms and Z-Transforms Convolution,
Superposition, block diagram representation and simplification; Open loop and
closed loop transfer function. Signal flow graphs, Transient and steady state
analysis; Proportional Integral and Derivative control system. PID controllers. State space analysis,
Stability, Nyquist and Routh Herwitz
Criteria, effect of feedback on stability and sensitivity; Root locus
technique; Frequency response analysis;
Bode Plots, Gain and phase margin, constant M and N Loci, use of Nichols
Chart. Design of control systems: different types of compensators and their
design through Bode plots and Root Locus techniques.
Components:
Potentiometer, Synchros,
Armature and field controlled DCG
servometers, A.C. servomotors, stepper
motor, Rotating amplifiers, magnetic amplifiers, tachogmenerators.
ETCS403 SOFTWARE
ENGINEERING L T C
3 1 4
Introduction:
Software Crisis Software
processes, Software life cycle models: Waterfall, Prototype, Evolutionary and
Spiral models, Overview of Quality Standards like ISO 9001, SEI-CMM
Software Metrics:
Size Metrics like LOC,
Token Count, Function Count, Design Metrics, Data Structure Metrics,
Information Flow Metrics.
Software Project
Planning
Cost estimation, static,
Single and multivariate models, COCOMO model, Putnam Resource Allocation Model,
Risk management.
Software
Requirement Analysis and Specifications
Problem Analysis, Data
Flow Diagrams, Data Dictionaries, Entity-Relationship diagrams, Software
Requirement and Specifications, Behavioral and non-behavioral requirements,
Software Prototyping.
Software Design
Cohesion & Coupling,
Classification of Cohesiveness & Coupling, Function Oriented Design, Object
Oriented Design, User Interface Design
Software
Reliability
Failure and Faults,
Reliability Models: Basic Model, Logarithmic Poisson Model, Calendar time
Component, Reliability Allocation
Software Testing
Software process,
Functional testing: Boundary value analysis, Equivalence class testing,
Decision table testing, Cause effect
graphing, Structural testing: path testing, Data flow and mutation
testing, unit testing, integration and system testing, Debugging, Testing
Tools, & Standards.
Software
Maintenance
Management of maintenance,
Maintenance Process, Maintenance Models, Reverse Engineering, Software
RE-engineering, Configuration Management, Documentation
ETEC -
405 NETWORK TECHNOLOGY L
T C 3 1 4
Evolution of Internet, Address and domain Management, SNMP, Transport
Layer issues, TCP/IP, FTP, WWW
undergoing technology, E mail talent, FTD, Gateway, Dial-up, SLIP/PPP
Dedicated lines, Internet searching tools, gopher, Archie, Veronica, WWW, Lynx,
Mosaic, WAIS, Usenet, Security issues, CGI, PERL, HTML, VRML, JAVA, VB script and
other internet development tools, internet networking TCP/IP protocols
Application Layer Services and protocols (RPC, NFC, SMTP, FTP, TELENET)
Network Security and Management, Review of LAN, Principles of IBASE5 (Strain),
Transmitter
and receiver of IBASE5 (Strain), Node, LAN Manager, Software
of IBASE5 Node, 10BASE5 Ethernet and 10BASE2 (Cheaper net), Twisted pair
Ethernet, Serial Communication, Connecting LANs and WANS, Serial Communication
Circuits, Modems, USART-Processor
Interface Data Buffer Block of 8251A, Control logic of USART, PROTOCOLS,
Transmitter, Receiver, Synchronous Modems and
Asynchronous Modems.
SYNDET/BRKDET ion 8251A, Monitoring of 8251A, writing characters to be
transmitted to 8251A, Monitoring of 8251A.
Read status, ISDN: Technology, devices, Architecture Protocols, Flow
Control Error detection and Correction, ATM, Technology, Inter Networking
SDH/SONET
B.Tech (Electronics & Communication Engg) VII Semester
ETEC -
407 OPTICAL COMMUNICATION L
T C 3 1 4
Comparison of Optical Fiber Cables
and Conventional Metallic cables and Advantages. Optical Fibers - Step-index, Single and Multimode, Graded
index, Other types of Fibers, Light propagation Total Internal Reflection,
Acceptance Angle and Numerical Aperture, Fiber Losses and Dispersion.
Optical Sources Light Emitting
Diodes Spontaneous Emission Materials for Visible & IR LEDs, LED
efficiency, Surface Emitting LED, Edge Emitters, Semiconductor Diode LASER
Stimulated Emission Double Heterostructure LASER Laser Tuning and
Degradation, Drivers for LED and LASER.
Photo Detectors Characteristics of
Photodetector Photoconductor, p-n Photodiode, Schottky Barrier and Heterojunction
Photodiodes, Avalanche Photodiode, Phototransistor, Optocouplers, Other
Detectors UV and Infrared Detectors.
Fiber End Preparation, Fiber
Splicing, Fiber Connectors, Connection Losses, Fiber Couplers, Fiber Materials
Fiber Fabrication, Mechanical Properties of Fibers, Fiber Cables, Fiber Cable
Installation.
Fiber Optic Communication System
Basic System Components, Coupling to and from the Fiber, Modulation,
Multiplexing and Coding, Repeaters, Bandwith and Rise time Budgets, Noise, Bit
Error Rate and Eye Pattern.
Applications of Fiber Optics Long Haul
Communication, Local Area Networks, Undersea Communication, Fiber Optic Sensors
Intensity Modulated Sensor, Phase Sensors, Diffraction Gratig Sensors (for
Measurement of Displacement, Force, Temperature), Medical Applications,
Military Applications, Coherent Optical Communication, Integrated Optics.
ETEC - 407 ADVANCED VLSI DESIGN L T C 3 1 4
Integrated Circuit Devices and Modeling: MOS and BJT transistor modelling for MOS Transistor & BJT SPICE modelling parameters CMOS and bipolar processing CMOS and analog layout consideration.
CMOS current mirror CS, CG & CD amplifier cascade gain stage bipolar current mirror bipolar gain stages frequency response SPICE simulation examples.
Noise Analysis: Time and frequency domain analysis noise models and analysis Op Amp: Two stage CMOS Op Amp Op Amp Compensation Folded cascade and differential Op Amp SPICE simulation examples CMOS and BiCMOS comparators.
MOS and CMOS sample and hold circuit bipolar and BiCMOS sample and hold switched capacitor circuits data converters various types of D/A and A/D converters.
Over sampling with and without noise shaping digital decimation filter multibit oversampling converters continuous time filters and phases locked loops.
ETIT - 409 Mobile Computing L T C 3 1 4
Introduction to Personal
Communications Services (PCS): PCS Architecture, Mobility management,
Networks signalling.
Global System for Mobile
Communication (GSM) system overview: GSM Architecture, Mobility management,
Network signalling.
General Packet Radio Services
(GPRS): GPRS Architecture, GPRS Network Nodes.
Mobile Data Communication: WLANs (Wireless LANs) IEEE 802.11 standard,
Mobile IP.
Wireless Application Protocol
(WAP): The Mobile Internet standard, WAP Gateway and Protocols, wireless
mark up Languages (WML).
Third Generation (3G) Mobile
Services: Introduction to International Mobile Telecommunications 2000 (IMT
2000) vision, Wideband Code Division Multiple Access (W-CDMA), and CDMA 2000,
Quality of services in 3G.
Wireless Local Loop(WLL): Introduction to WLL Architecture, wireless
Local Loop Technologies.
Global Mobile Satellite
Systems; case studies of the IRIDIUM and GLOBALSTAR systems.
Wireless Enterprise Networks: Introduction to Virtual Networks, Blue tooth technology, Blue tooth Protocols.
ETIT
- 411 RELIABILITY
ENGINEERING L T C
3 1 4
Reliability Fundamentals: Introduction, Need for Reliability Engineering, Definition, Causes of Failures, Catastrophic Failures and Degradation Failures, Characteristic Types of Failures, Useful Life of Components, The Exponential Case of Chance Failures, Reliability Measures, Failure Data Analysis.
Reliability Mathematics:
Fundamentals of Set Theory, Probability Theory, Random Variables, Discrete
Distributes, Continuous Distributions, Stochastic Processes, Markov Chains
Reliability Analysis of Series
Parallel Systems: Introduction, Reliability Block Diagrams, Series Systems,
Parallel Systems, Series Parallel Systems, K-out-of-M Systems, Open and Short
Circuit Failures, Standby Systems.
Reliability Analysis Nonseries
Parallel Systems: Introduction, Path Determination, Boolean Algebra Methods, A
Particular Method, Cut Set Approach, Delta-Star Method, Logical Signal
Relations Method, Bayes Theorem Method.
Reliability Prediction:
Introduction, Purpose, Classification, Information Sources for Failure Rate
Data, General Requirements, Prediction Methodologies, Software Prediction
Packages, Role and Limitation of Reliability Prediction.
Reliability Allocation:
Introduction, Subsystems Reliability Improvement, Apportionment for New Units,
Criticality.
Redundancy Techniques for
Reliability Optimization: Introduction, Signal Redundancy, Time Redundancy,
Software Redundancy, Hardware Redundancy.
Maintainability and Availability:
Introduction, Forms of Maintenance, Measures of Maintainability and
Availability, Maintainability Function, Availability Function, Two Unit
Parallel System with Repair, Preventive Maintenance, Provisioning of Spares.
Reliability Testing:
Introduction, Kinds of Testing, Component Reliability Measurements, Parametric
Methods, Confidence Limits, Accelerated Testing, Equipment Acceptance Testing,
Reliability Growth Testing.
ETEC -
413 POWER ELECTRONICS L T C 3 1 4
Power Semiconductor Devices: Two-transistor Model of Thyristor, Methods of
Triggering a Thyristor, Thyristor Types.
Triggering Devices: Triggering Devices, Unijunction Transistor,
Characteristics and Applications of UJT, Programmable Unijunction Transistor,
DIAC, Silicon-Controlled Switch, Silicon Unilteral Switch, Silicon Bilateral
Switch, Shockley Diode, Opto-Isolators.
Thyristor Firing Circuits Turn on systems: Requirements for Triggering Circuits, Thyristor
Firing Circuits, Full Wave Control of AC with One Thyristor, Light Activated
SCRs (LASCR) Control Circuit, Pulse Transformer Triggering, Firing SCR by UJT,
TRIAC Firing Circuit, Phase Control of SCR by Pedestal and Ramp
Controlled Rectifier: Types of Converters, Effect of Inductive Load,
Commutating Diode or Free-Wheeling Diode, Controlled Rectifiers, Bi-Phase
Half-Wave (Single Way), Single-Phase Full-Wave Phase Controlled Converter Using
Bridge Principle (Double Way), Harmonics
Inverters: Types of Inverters, Bridge Inverters, Voltage Source Inverters (VSI),
Pulse Width Modulated Inverters, Current Source Inverter
AC Voltage Controllers: Types of AC Voltage Controllers, AC Phase Voltage
Controllers, Single-Phase Voltage Controller with R-L Load, Harmonic Analysis
of Single-Phase Full-Wave Controller with R-L Load, Gating Signals
DC to DC Converters (Choppers): DC Choppers, Chopper classification, Two Quadrant
Chopper, Four Quadrant Chopper, Morgan Chopper.
Cycloconverters: Types of Cycloconverters, Single-Phase
Cycloconverter, Three-Phase Cycloconverters. Thyristor Protection: Protection,
dv/dt Protection, di/dt Protection, Over Voltage Protection
Industrial Applications: One Shot Thyristor Trigger Circuit, Overvoltage
Protection, Simple Battery Charger, Battery Charging Regulator, AC Static
Switches DC Static Switch Microprocessor
based Applications:
ETIT -
415 ADVANCED COMPUTER
ARCHITECTURE L T C 3 1 4
Parallel Computer Models: The state of computing,
multiprocessors and multicomputers, multivector and SIMD computers,
architectural development tracks.
Program and Network Properties: conditions of parallelism, program partitioning and scheduling,
program flow mechanisms.
System Interconnect Architectures: Network properties and
routing, static interconnection networks and dynamic interconnection networks.
Processors and Memory Hierarchy: Advanced processor
technology- CISC, RISC, Superscalar, Vector, VLIW and symbolic processors,
Memory hierarchy technology, Virtual
memory technology.
Bus, Cache and
Shared Memory.
Linear Pipeline Processors, Nonlinear Pipeline processors, Instruction Pipeline Design, Arithmetic Pipeline Design, Multiprocessors System Interconnects, Cache Coherence and Synchronization Mechanisms, Vector Processing Principles, Multivector Multiprocessors and Data Flow Architecture.
Code No: ETEC 417 L T
Paper : Optical Communication 2 0
Introduction:
Measurement
of Information, Channel Capacity, Communication System Architecture, Basic
Optical Communication System, Advantage of Optical Communication System.
Propagation in Dielectric Waveguides:
Introduction,
Step-index Fibers, Graded Index Fibers, Modes & Rays, Slab Wave Guide.
Attenuation in Optical Fibers:
Introduction,
Absorption, Scattering, Very Low Loss Materials, All Plastic &
Polymer-Clad-Silica Fibers
Wave Propagation:
Wave
Propagation in Step-Index & Graded Index Fiber, Overall Fiber
Dispersion-Single Mode Fibers, Multimode Fibers, Dispersion-Shifted Fiber,
Dispersion, Flattened Fiber, Polarization.
Source & Detectors:
Design
of LEDs for Optical Communication, Semiconductor Lasers for Optical Fiber
Communication System, Semiconductor Photodiode Detectors, Avalanche Photodiode
Detectors & Photo multiplier Tubes.
Optical Fiber Communication System:
Telecommunication,
Local Distribution Series, Computer Networks Local Data Transmission &
Telemetry, Digital Optical Fiber Communication System-First Generation, System,
Second Generation System, Future System.
Data
Communication Networks Network Topologies, Mac Protocols, Analog System.
Advanced
Multiplexing Strategies Optical TDM, Sub carrier Multiplexing, WDM Network
Architecutres; SONET/SDH, Optical Transport Network, Optical Access Network,
Optical Premise Network.
Applications-Military
Applications, Civil, Consumer & Industrial Applications.
Code No: ETIT 419- ARTIFICIAL INTELLIGENCE L T
2 0
Scope of AI
Games, theorem proving, natural language processing, vision and speech processing, robotics, expert systems, AI techniques- search knowledge, abstraction.
Problem solving
State space search; Production systems, search space control: depth-first, breadth-first search, heuristic search - Hill climbing, best-first search, branch and bound. Problem Reduction, Constraint Satisfaction End, Means-End Analysis
Knowledge Representation
Predicate Logic: Unification, modus pones, resolution, dependency directed backtracking.Rule based Systems : Forward reasoning: conflict resolution, backward reasoning: use of no backtrack.
Structured Knowledge Representation: Semantic Nets: slots, exceptions and default frames, conceptual dependency, scripts.
Handling uncertainty
Non-Monotonic Reasoning, Probablistic reasoning, use of certainty factors, fuzzy logic.
Learning
Concept of learning, learning automation, genetic algorithm, learning by inductions, neural nets.
Expert Systems
Need and justification for expert systems, knowledge acquisition, Case studies: MYCIN, RI.
ETEC 451 CONTROL SYSTEMS LAB P C 2 1
Experimental work based upon the course Control System (ETEC 401)
ETEC 453
SOFTWARE ENGINEERING LAB P C 2 1
Experimental work based upon the course Software Engineering (ETEC 403)
ETEC 455-
NETWORK TECHNOLOGY LAB P C 2 1
Experimental work based upon the course Network Technology (ETEC 405)
ETEC 457 Practical based on ELECTIVES P C 2 1
Experimental work based upon the course ELECTIVES
ETCS 459 - PROGRAMMING II P C 2 1
ETEC 461 PRACTICAL TRAINING P C - 3
ETEC
402 CONSUMER ELECTRONICS
Audio and Video Systems:- High-fi
Stereophonic audio system, Recording and Reproduction, Review of AM, FM
Transmission and Reception, Video System, Color TV, Terrestrial and Satellite
Broad casting, Cable TV, HDT and Digital TV, DTH TV, LCD, Plasma TV.
VCD, DVD, VCR, Video Camera, Remote Control, Touch Tone Telephone Set,
Value addition in telephone sets, Fax,
Mobile telephone hand set.
Convergence Technology
Video Signal Processing Algorithm for video signal processing.
ETCS 404
SATELITE AND MOBILE COMMUNICATION
L
T C
3 1 4
Introduction to Transmission Media, Copper, Fiber, Space. Antennas Concepts of a radiating dipole, Directional and Omni Directional antennas, Radiation patterns, Phased array, , Rhombic, Parabolic, gain, efficiency, gain to noise temp. ratio, Capture area.
Orbital mechanics of Satellite:- Apogee, perigee, elliptical, spherical,
Some Communication Satellites:- Historical perspective and recent Status.
Communication Building Block:- Sub Systems and systems, up-link and down-link, isolators, circulators, mixers, filters, demodulators, threshold extension.
Concepts of Microstrip lines, MICs, Review of Microwave components like Wave guide-rectangular, circular, cut-off frequency, bends, twists, and attenuators
Review of modulation techniques like TDMA, FDMA, FM. Analogue and digital techniques, encoding, decoding, quadrature modulation, channel capacity, phase locked loop techniques.
Optical Communication: - System model, optical sources, semiconductor lasers, light emitting diodes, optical modulation, space channels, guided channels, optical fiber wave guides, coupling components, optical receivers, typical optical communication systems and their performance.
Cellular Communication Cells, Frequency allocation and control, Base System and Master System, GSM, DCS 1800, Various value added services. Algorithm for mobile communication.
ETEC - 406 INSTRUMENTATION L T C
3 1 4
Review of Instrumentation Amplifier, Magnetic Recorder, Digital recorders of memory type, Storage Oscilloscope, Sampling Oscilloscope and Spectrum Analyser
Special Purpose Transformers, Constant Voltage Transformer, Types of Rectifiers Signal Phase Rectifier, Three Phase Rectifier, Three Phase Controller Rectifier, Switch Mode Power Supply (SMPS), Inverter and Uninterrupted Power Supply (UPS)
Timers, Dashpot timers, Motor driven Timers, Stepper motor and their types, Permanent magnet and variable reluctance type, a.c. Motor Controllers Variable Frequency inverters and cycloconverters.
Automatic weighing system, Carbon dioxide controller for a carburising furnace, Control of relative humidity in a textile moisterning process and warehouse, Induction Heating, Dielectric Heating.
Programmable Logic Controller (PLC), General characteristics and system layout, Operational procedures, Control of coils and contacts, PC ladder Instruction Address and Registers, Timers and Counters, The sequencer, analog operation and loop control.
Robotics Robot
and their uses, Robot Auxillary control devices and systems, Controlling and
Programming, A Pick-and-Place Robot, Work cells controlling and programming.
ETEC - 408
INTEGRATED CIRCUITS TECHNOLOGY L T C
3 1 4
Classification of ICs. Electronic grade Silicon, Czochralski and Flot
Zone Crystal Growing Methods, Oxygen and carbon in Silicon, Zegregation
coefficients, Silicon shaping and wafer preparation, Vapour Phase Epitaxy.
Oxidation Thermal, Dry & Wet, High Pressure and Plasma Oxiadation, Lithography Optical Lithography, Photomask, Photo resist and Process, Electron Lithography, X-ray Lithography, Ion Beam Lithography.
Etching Wet Chemical Etching, Reactive etching, Impurity Doping Diffusion, Ion Implanatation, Metallization Desired Properties, Applications, Ohmic contacts, Choices and Problems.
Integrated Elements: Isolation of circuit elements, Bipolar Technology: NPN Transistors, PNP Transistors, Integrated Diodes, Semiconductor Resistors, Capacitors and Inductors, MOS Technology: NMOS and CMOS IC Technology
Design of typical ICs, Back side of preparation, Wafer sort, Device Separation, Die Bonding, Wire Bonding, Package Types and Considerations, Testing of ICs.
Fabrication Facilities and Environment pure water system, clean room and personnel, Characteristics of VLSI, Problem of raising the scale of integration Causes of IC failures Electronistatic Discharge Damage and Alpha Particle Induced soft errors, Yield and Reliability, Methods of reliability evaluation, Nonsilicon Technology (GaAs ICs), Future trends.
ETEC - 410
DIGITAL IMAGE PROCESSING
L
T C
3 1 4
Digital Image Representation, Fundamental Steps in Image Processing, Elements of Digital image processing systems, Sampling and quantization, some basic relationships like neighbours, connectivity, Distance measure between pixels, Imaging Geometry.
Image Transforms
Discrete Fourier Transform, Some properties of the two-dimensional fourier transform, Fast fourier transform, Inverse FFT.
Image Enhancement
Spatial domain methods, Frequency domain methods, Enhancement by point processing, Spatial filtering, Lowpass filtering, Highpass filtering, Homomorphic filtering, Colour Image Processing.
Image Restoration
Degradation model, Diagnolization of Circulant and Block-Circulant Matrices, Algebraic Approach to Restoration, Inverse filtering, Wiener filter, Constrained Least Square Restoration, Interactive Restoration, Restoration in Spatial Domain.
Image Compression
Coding, Interpixel and Psychovisual Redundancy, Image Compression models, Error free comparison, Lossy compression, Image compression standards.
Image Segmentation
Detection of Discontinuities, Edge linking and boundary detection, Thresholding, Region Oriented Segmentation, Motion based segmentation.
Representation and
Description
Representation schemes like chain coding, Polygonal Approximatiion, Signatures, Boundary Segments, Skeleton of region, Boundary description, Regional descriptors, Morphology.
Recognition and
Interpretation
Elements of Image Analysis, Pattern and Pattern Classes, Decision-Theoretic Methods, Structural Methods, Interpretatiion.
Code No: ETEC 412 L T
Paper : MICROWAVE DEVICES 3 1
Microwave tubes: Klystron amplifier two cavity multi cavity description operating characteristics performance characteristics pulse modulation bandwidth, Travelling wave tube amplifier construction operation crossed field amplifier grid controlled tubed, Magnetron oscillator conventional magnetron coaxial magnetron mode jumping frequency pushing and pulling performance chart & rieke diagram.
Avalanche transit-time devices: Introduction the physics of IMPATT diodes small signal and large signal analysis effects of tunnelling on IMPATT diodes performance application TRAPATT devices present trends in IMPATT devices Lateral IMPATT devices monolithic IMPATT oscillator circuits.
Transferred electron devices and circuits: Introduction physical basis of Gunn effect modes of operation study of TEDs and modelling Gunn diode or TED oscillators multiple Gunn-device oscillators or power combiners generation ofmm waves Gunn diode amplifier present status of GaAs and Inp TEDs new materials and new ideas applications.
Microwave Transistors: Introduction n-p-n junction transistor microwave BJT HBT, MESFET, - power frequency limitations noise figure low noise microwave HEBT MOSFETs Multi octave YIG tuned GaAs FET oscillators dielectric tuned FET oscillators for stable oscillations microwave transistor amplifier.
Technology of microwave devices and measurements: GaAs Gunn diode fabrication fabrication of silicon IMPATT diode fabrication of low noise HEMT MICs: HMICs, MICs and QMICs fabrication of MMICs using FETs measurement of s-parameters of microwave semiconductor electron devices power, frequency and spectral response measurements Riecke diagram and noise measurements of semiconductor circuits wafer measurements of MMICs.
Code No: ETIT 414 L T
Paper : Network Management and Security 2 0
Introduction:
Codes and Ciphers Some Classical systems Statistical theory of
cipher systems-Complexity theory of crypto systems Stream ciphers, Block
ciphers.
Stream Ciphers: Rotor based system shift register based systems Design considerations for stream ciphers Cryptanalysis of stream ciphers Combined encryption and encoding.
Block Ciphers DES and variant, modes of use of DES.
Public key systems Knacksack systems RSK Diffle Hellman Exchange Authentication and Digital signatures, Elliptic curve based systems.
System Identification and clustering
Cryptology of speech signals narrow band and wide band systems Analogue & Digital Systems of speech encryption.
Network Security: Hash function Authentication:
Protocols Digital Signature standards.
Electronics Mail Security PGP (Pretty Good Privacy) MIME, data Compression technique.
IP Security: Architecture, Authentication Leader, Encapsulating security Payload Key Management.
Web security: Secure Socket Layer & Transport Layer security, Secure electronics transactions.
Firewalls Design principle, established systems.
Telecommunication Network architecture, TMN management layers, Management information Model, Management servicing and functions, Structure of management information and TMN information model.
Code No: ETEC 416 L T
Paper : Embedded Systems 2 0
Architectures: Basic
definitions, The bottlenecks in the Non Neuman paradigm cache memories:
Principles, alternative organization, figure of merit, performance evaluation,
Cache management issues, Multiple level caches, Innovative CPU architectures:
basic figures of merit for performance evaluation, Pipelining: the RISC
approach hints at pipelined CISC CPUs. The basic MIPS pipeline exception
handling.
ILP Architectures: The
basic idea, Dynamic scheduling, static scheduling, super scalar architecture,
basic principles and problems, Out of order execution and its management. Score
boarding, reservation stations, the reorder buffer, Hazard problem and
management in super scalar CPUs. Speculative execution and its optimization.
Exception handling, Reference to some real world super scalar CPUs. Basic
characteristics of DSP processors Multiprocessor system: The cache coherence
problem, NUMA, CC-NUMA systems, Basic concepts of multithreading, simultaneous
multithreading, speculative multithreading, Testing techniques, fault diagnosis
and fault tolerance techniques, fault tolerant softwares.
Introduction to compilers,
cross compilers, building blocks and interfaces of front-ends, Code Scanning,
parsing, semantic analysis, intermediate representations.
PCI (Compact PCI), ISA (PC
104) and VME bus architecture and programming, device firmware, system firmware
architectures, ECC/FDAC memory architectures, Interrupt service routine (ISR),
real time clock/Timer, real time kernal configuration, main loop design,
multitasking, inter-task communication, hard real time scheduling theory and
design (RMA and DMA), latency response time, system performance, development
and testing techniques.
ETEC 452 CONSUMER ELECTRONICS LAB P C
2 1
Experimental work
based upon the course Consumer Electronics (ETEC 402)
ETCS 454
SATELLITE & MOBILE COMMUNICATION LAB P C
2 1
Experimental work based upon the course Mobile and Satellite Communication (ETCS 404).
ETEC 456
- Practicals based on ELECTIVES P C
2 1
Experimental work based upon the course (ELECTIVES)
ETEC 458
- PROJECT P C
8 8
From the following 11 Groups of
Electives, 4 Papers have to be chosen :